H610M DDR4 Core Cpu 12/13 Generation Motherboards
  • H610M DDR4 Core Cpu 12/13 Generation Motherboards
  • H610M DDR4 Core Cpu 12/13 Generation Motherboards
  • H610M DDR4 Core Cpu 12/13 Generation Motherboards
  • H610M DDR4 Core Cpu 12/13 Generation Motherboards
  • H610M DDR4 Core Cpu 12/13 Generation Motherboards
  • H610M DDR4 Core Cpu 12/13 Generation Motherboards

H610M DDR4 Core Cpu 12/13 Generation Motherboards

Brand JGINYUE

Product origin China

Delivery time 7 days

Supply capacity 10000

H610M-VDH mainboards have been sold all over the world with a cumulative sales volume of 100000 +, and the quality is strictly controlled, which is highly praised.

1. Supports the 12/13th generation Intel Core i9/i7/i5/i3/Pentium/Celeron processors and DDR4 memory, with a maximum memory capacity of 64GB.

2. Equipped with multiple interfaces such as 1 PCI-E 3.0 x16 slot, 2 PCI-E 3.0 x1 slots, 4 SATA 6.0 interfaces, 1 M.2 interface, 1 Gigabit Ethernet port, 4 USB 3.2 Gen 1 interfaces, 2 USB 2.0 interfaces, etc., it is fully functional.

3. Support technology, which can provide a more stable power supply and improve system performance.

4. Support DDR4 Boost technology, which can provide more stable and high-speed memory performance.

5. Support PCI-E Steel Armor technology, which can protect PCI-E slots and improve their stability and durability.

6. Featuring a miniature ATX size, suitable for small chassis and compact computers.

H610M DDR4 Core Cpu 12/13 Generation Motherboards

H610M 12 Generation Motherboard

Brand NameJGINYUE
Motherboard model

H610M-VDH

Socket Type

LGA 1700

ChipsetIntel H610
Maximum Ram Capacity64 GB
Support Memory TypeDDR4

PCI - E standards

PCI - E 4.0
Form Factor

M-ITX

Main board size

240*190mm

Memory interfac

Front USB 2.0*1 USB 3.2*1 Rear USB 3.2*2 USB 2.0*4

Netwo*1rk card interfac

Gigabit Nic interface


1. Supports the 12/13th generation Intel Core i9/i7/i5/i3/Pentium/Celeron processors and DDR4 memory, with a maximum memory capacity of 64GB.


2. Equipped with multiple interfaces such as 1 PCI-E 3.0 x16 slot, 2 PCI-E 3.0 x1 slots, 4 SATA 6.0 interfaces, 1 M.2 interface, 1 Gigabit Ethernet port, 4 USB 3.2 Gen 1 interfaces, 2 USB 2.0 interfaces, etc., it is fully functional.


3. Support technology, which can provide a more stable power supply and improve system performance.


4. Support DDR4 Boost technology, which can provide more stable and high-speed memory performance.


5. Support PCI-E Steel Armor technology, which can protect PCI-E slots and improve their stability and durability.


6. Featuring a miniature ATX size, suitable for small chassis and compact computers.


H610M 13 Generation Motherboard

Packaging, Loading and Shipping


When it comes to packaging, loading and shipping of goods, it is important to ensure that everything is done in a professional manner to ensure the safety of the goods and timely delivery to the recipient.


Firstly, the packaging of the goods should be done in a way that protects them from damage. This may involve using appropriate packaging materials such as bubble wrap, foam, or cardboard boxes to protect the goods from any potential damage during transportation.


Once the goods are packaged, it is important to load them onto the transport vehicle carefully. This involves ensuring that the weight is evenly distributed and that the goods are secured in place to prevent any movement during transportation.


Finally, the goods should be shipped off to the recipient in a timely manner. This may involve coordinating with the shipping company and ensuring that all necessary documentation is completed and submitted.


In conclusion, the packaging, loading, and shipping of goods requires careful attention to detail to ensure that the goods are protected and delivered safely and on time. By following these steps, businesses can ensure that their products reach their destination in the best possible condition.



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